Integrated circuits. Three dimensional integrated circuits - Model and measurement conditions of through-silicon viaWhat is BS IEC 63011 3 about? BS IEC 63011 3 is the third part of the BS IEC 63011 series of standards that specifies a reference model of through silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3 D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3 D IC. Note: 3 D IC specifications covered by BS

Security authorities

BS EN 12350-3 specifies a method for determining the consistency of fresh concrete by means of the Vebe time

BS EN 490:2004+A1:2006 Concrete roofing tiles and fittings for roof covering and wall cladding

Relationship between this European Standard and the Essential Requirements of EU Directive 93/42/EEC on medical devices

dependability

The scope of this specific part is to standardise the:

software licensors

Risk of corrosion and damage to fixtures

The PAS will be extremely useful to a wide range of related professionals as well as parents and parent groups

Only the intended use of products as defined by the manufacturer is within the scope of this standard

7 Hygiene requirements

Organizations with an interest in water supply services in the UK and organizations referring to the withdrawn BS 6700 would also benefit from referencing BS 8558